The Senior Director, Principal MTS is a senior technical leader responsible for defining and driving panel scaling technology strategy and customer-facing execution across next-generation advanced packaging and substrate platforms. This role leads cross-functional alignment to accelerate panel-level form factor scaling, RDL scaling, and ecosystem readiness—connecting customer needs to integrated equipment/process solutions and strategic partnerships.
This position operates at the intersection of technology roadmaps, account strategy, and disruptive pathfinding, translating panel scaling inflections into executable customer engagements, demo programs, and internal investment priorities.
- Own the panel scaling technology roadmap across form factor scaling, interconnect scaling, and substrate scaling, including transitions from wafer-based approaches to panel-based architectures.
- Define technology inflections and integration milestones for advanced panel build-up and align internal roadmaps to customer adoption cycle
- Build and manage a partner ecosystem spanning substrate makers, material suppliers, OSATs, foundries, and research institutes to close panel scaling gaps (design rules, warpage, overlay, defectivity, metrology/inspection, reliability).
- Identify, evaluate, and activate disruptive partners and collaborations to accelerate panel readiness and strengthen differentiation.
o Drive internal alignment across engineering, product lines, marketing, and finance on portfolio gaps and priorities required to lead in advanced panel packaging.
- Resolves exceptionally complex field process issues utilizing systematic troubleshooting methodology generally involving multiple processes. Create a mechanism to communicate issues, track progress and pull resources from multiple divisions and/or functions. Uses sound statistical techniques like and problem solving methodologies DOEs (Design of Experiment) to quickly determine root cause and action plans. Communicates learnings from this portion to rest-of-world to strengthen the product packages.
- Serves as the customer expert across a broad range of exceptionally complex products. Plays a key role in defining product strategy and identifying gaps. Provides feedback to division heads on process and hardware improvements to meet customer roadmap requirements.
- Directs the positioning of new technologies to customers utilizing technical information from divisions. Interfaces with customers at key development and manufacturing sites to form strategic partnerships to evaluate new and emerging technologies and oversees joint development activities or beta-site testing programs. Makes senior executive level presentations.
- Keeps abreast of new developments in own and related technology groups. Participates in publishing in ET conferences and journals.
- Demonstrates broad and comprehensive understanding of different systems, theories and practices regarding advanced packaging as well as the changing business environment
- Applies in-depth advanced packaging knowledge, business and commercial expertise to differentiate itself from the competition
- Visionary Business & Technology Leader: Shapes strategy at the intersection of advanced technology and customer value, turning complex challenges into scalable, market‑leading solutions.
- Trusted Executive Partner: Builds credibility with C‑suite leaders, customers, and partners through clear communication, strong judgment, and a collaborative leadership style.
- Decisive Change Agent: Thrives in fast‑paced, ambiguous environments—driving alignment, making high‑impact decisions, and delivering results.
- People‑First Leader: Inspires and develops world‑class teams, fostering a culture of innovation, accountability, and continuous growth.
- Evaluates key business challenges; directs the development of new or innovative solutions
- Guided by company strategy and business objectives, impacts results of segment/function
- Influences and negotiates at the top executive levels, with great latitude on
- outcomes; presents and defends complicated or delicate issues
- 15+ years experience in semiconductor packaging, substrates, panel processing, lithography/patterning, deposition/etch, or adjacent advanced manufacturing domains.
- Demonstrated leadership in technology strategy + customer execution (principal-level account leadership, platform adoption, or roadmap ownership).
- Strong working knowledge of advanced packaging drivers: panel form factor scaling, RDL scaling, TGV/glass & organic substrate trends, and manufacturing/yield constraints at large format
- Proven ability to lead cross-functional organizations and influence without direct authority across engineering, product teams, and external partners.
- Executive communication strength: translating complex technical tradeoffs into business outcomes and decisions.
- PhD/MS in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or equivalent experience.
- Prior experience launching new platforms (e.g., panel-based process modules, integrated packaging lines, or disruptive substrate architectures
- Demonstrated track record of ecosystem building (materials, substrate suppliers, research institutes, foundries/OSATs)
- Travel as needed for strategic customer engagements, partner meetings, and industry/consortia events.