Process Development Engineer - SMT/PCB Assembly/Packaging

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

• Develop and optimize SMT, semiconductor packaging, and advanced assembly processes.
• Support both volume production as well as New Product Introduction (NPI) production.
• Support manufacturing for surface mount electronics (SMT), Flip Chip Attach and Die Attach.
• Lead process characterization, DOE execution, and process window development
• Evaluate new equipment, processes, and materials.
• Generating post build/DFM report.
• Take 5S/process improvement initiatives.
• Monitor Product Yields daily and work with appropriate engineers to take corrective actions.
• Work with Fixturing vendors to design and support assembly in the factory.
• Mentor technicians and operators on process control and best practices.
• Develop process documentation, work instructions, control plans, and manufacturing standards.

• BS in Mechanical, Electrical, Manufacturing, Material engineering degree or related discipline; MS degree preferred.
• 2+ years industry experience required or postgraduate degree accepted in lieu of industry experience
• Relevant industry internship experience desired.
• Strong Semiconductor Assembly experience with High density of fine pitch components – BGA, LGA, QFN, 0201, 01005 components, etc
• 1-2 years of experience in a mid to high-volume manufacturing environment preferred
• Experience with reflow, pick and place and solder paste printing is preferred
• Experience with SPC techniques and Lean practices is preferred
• Knowledge of IPC-A-610 standard preferred

• Strong technical leadership
• Excellent communication skills
• Project management capability
• Cross-functional collaboration
• Continuous improvement mindset

This position is not eligible for visa sponsorship by the Company.

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MAKE A DIFFERENCE AT QORVO

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.