Senior Director - TeraWave Ground Terminals

We are seeking a Senior Director to lead the development of a next-generation satellite communications ground systems including the RF user terminal and RF gateway, from concept through manufacturing transfer. This leader will own a multidisciplinary team responsible for hardware architecture, embedded software, systems integration, validation, and production readiness at a contract manufacturer.

- Lead hardware, embedded software, and systems engineering teams developing compact, rugged, high-performance communications terminals. - Define product architecture across RF, digital, power, thermal, mechanical, firmware, and manufacturing domains. - Drive execution from prototype to high-volume production, including design for manufacturability, testability, reliability, and cost. - Partner with manufacturing and supply chain teams to select components, qualify suppliers, and transfer designs to a contract manufacturer. - Establish program plans, technical milestones, risk management, and cross-functional coordination with operations, quality, and product management. - Own system-level integration, bring-up, debugging, and validation strategy for hardware and firmware. - Ensure embedded software supports secure boot, device provisioning, field updates, telemetry, diagnostics, and factory test. - Build and mentor a high-performing team of engineers and technical leads. - Manage external partners, including contract manufacturers, test labs, and specialist consultants. - Create and maintain engineering processes for requirements management, change control, verification, and release readiness.

- 12+ years of experience in hardware and embedded systems development, with at least 8 years leading technical teams. - Proven success bringing complex connected hardware products from prototype to mass production. - Strong background in embedded systems, board design, system integration, and production test. - Experience working with contract manufacturers and driving design transfer to manufacturing. - Familiarity with RF-enabled products, high-speed digital design, power electronics, thermal design, and ruggedized consumer or industrial hardware. - Experience with Linux-based embedded platforms, real-time constraints, boot flows, device provisioning, and firmware update mechanisms. - Strong understanding of reliability engineering, root cause analysis, and failure analysis. - Ability to lead across hardware, firmware, operations, and quality functions in a fast-paced environment. - Excellent communication and organizational skills, with a track record of delivering on aggressive timelines.

- Master's degree in electrical, mechanical or software engineering, or related field. - Experience with satellite communications, antenna systems, phased arrays, or wireless networking hardware. - Background in secure hardware, cryptography, anti-tamper, or device identity systems. - Familiarity with regulatory and compliance requirements for consumer electronics and radio products. - Experience scaling production from low-volume engineering builds to millions of units.

Hands-on experience with contract manufacturing test development and factory yield improvement.

Base Pay Range for: CA applicants is $317,388.00 - $444,342.15 WA applicants is $317,388.00 - $444,342.15