Principal PIC Process Engineer

As a Principal PIC Process Development Engineer , you will be a senior individual contributor within Nokia's Optical Components organization, responsible for the development, optimization, and transfer of InP photonic integrated circuit (PIC) and laser fabrication processes for high-volume manufacturing .

This role requires deep technical expertise across epitaxial design, semiconductor processing, data-driven manufacturing analysis, and close collaboration with remote fabrication partners . You will play a key role in enabling next-generation optical component technologies that support Nokia's high-capacity optical networking platforms.

- Ph.D. in Electrical Engineering, Physics, or a related field - Minimum 10 years of experience developing and characterizing materials and devices for optoelectronic applications - Deep expertise in:

- PIC device physics - Semiconductor, metal, and dielectric materials properties, characterization methods, and data interpretation - Opto-electronic testing of PIC devices - Modeling, simulation, scripting , and working with large, complex data sets - Physics-based and data-driven root cause analysis

- Demonstrated ability to drive cross-functional engineering teams to measurable outcomes - Excellent communication and organizational skills

- Experience supporting technology transfer to high-volume manufacturing - Familiarity with yield ramp, qualification, and reliability testing for photonic devices - Strong communication skills with the ability to translate complex technical issues across disciplines - Experience working in foundry or captive fab environments supporting compound semiconductor technologies

- Lead the design, development, and optimization of InP PIC and laser fabrication processes for high-volume manufacturing - Design and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliers - Develop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints - Drive process integration , ensuring compatibility across metal, semiconductor, and dielectric modules

- Perform extensive data analysis of photonic device, wafer, and process data in a manufacturing environment - Apply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performance - Lead or contribute to FMEA activities , root cause analysis, and corrective actions for yield and reliability issues - Define and utilize metrology strategies to ensure robust process control

- Shepherd wafers successfully through the fab , coordinating closely with test, development, integration, and fabrication engineers - Act as a senior technical interface with external or remote fabrication facilities , ensuring alignment on process execution and priorities - Collaborate with device design, product engineering, and reliability teams to support technology readiness and product ramp

- Provide technical leadership within the PIC process development domain - Contribute to continuous improvement of tools, methods, and best practices - Mentor junior engineers and support knowledge transfer across the broader team