Advanced Packaging SI/PI Senior Engineer

- BS degree in a technical field (Electrical Engineering, Computer Engineering, or related) with coursework or hands-on exposure to signal integrity and power delivery concepts with 3+ years of relatable experience OR - MS degree in a technical field (Electrical Engineering, Computer Engineering, or related) with coursework or hands-on exposure to signal integrity and power delivery concepts - Experience with simulation and analysis tools such as Ansys HFSS, Keysight ADS, or Cadence Sigrity - Working knowledge of circuit extraction and simulation techniques - Scripting ability for simulation automation and data processing - Familiarity with semiconductor packaging technologies, substrate, or PCB design - Strong communication and documentation skills - Interest in growing into package and PCB electrical design work