Process Engineer - Die to Wafer Hybrid Bonding

We are seeking hands on Process Engineers to drive die to wafer (D2W) hybrid bonding R&D. This role focuses on hybrid bonding process development, pathfinding, technology de risking, and advanced packaging integration exploration.

The role provides on the job training and hands on experience with state of the art equipment, including the industry’s first fully integrated die to wafer hybrid bonding system.

Key Responsibilities

• Develop die to wafer hybrid bonding processes, including (but not limited to): Surface preparation and plasma activation High accuracy die placement and alignment Post bond characterization and process evaluation
• Integrate D2W bonding with adjacent process modules such as: Dicing and die preparation Die thinning Inter die gap fill and planarization
• Design and execute DOE driven experiments to understand process limits, sensitivities, and trade offs.
• Own process optimization, perform failure analysis and characterization, and drive continuous engineering improvement.

Qualifications

• Ph.D. or M. S. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline.
• In depth knowledge and hands on experience in one or more of the following: Die to wafer or wafer to wafer hybrid bonding Thin die handling and alignment critical processes Micro-LED or CPO experience Heterogeneous integration such as III-V to Si, novel materials to Si 2.5D/3D integration Direct process engineer experience on mainstream semiconductor equipment (plasma, wet clean, overlay/alignment, etc.)
• Strong understanding of: Bond interface physics Alignment and overlay fundamentals Mechanical behavior of thin and fragile dies
• Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP).
• Self starter with strong problem solving skills; able to work both independently and collaboratively with minimal supervision.
• Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.

Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 10% of the Time Relocation Eligible: Yes The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.

In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor.

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