Global Product Support (GPS) Engineer - Advanced Packaging

Applied Materials is seeking a Global Product Support (GPS) Engineer to support installation, startup, qualification, and ongoing operation of the Kinex Hybrid Bonding platform being deployed for the CTO advanced packaging development programs.

The successful candidate will serve as the primary equipment support engineer responsible for bringing the system from installation through process readiness while coordinating closely with Facilities, BESI, Applied Materials product engineering teams, and CTO process development teams.

This role combines hands-on equipment support, system integration, startup execution, facilities coordination, and vendor engagement. The engineer will play a key role in establishing Kinex as a strategic advanced packaging platform supporting die-to-wafer hybrid bonding, optical interconnect, and next-generation heterogeneous integration development.

- Support Kinex installation activities from tool dock through release to engineering users - Coordinate Tier 0, Tier 1 and Tier 2 startup activities - Drive closure of installation punch-list items - Support factory acceptance and site acceptance activities with vendors - Develop recovery plans for installation and startup issues

- Support Facility Data Sheet (FDS) development and updates - Coordinate with Facilities, EHS and infrastructure teams - Define and validate tool utility

requirements - Support hookup and qualification activities

- Perform troubleshooting of mechanical, electrical, automation, and process-related issues - Develop preventative maintenance procedures - Support uptime improvement efforts - Analyze equipment performance and reliability trends - Drive root cause investigations and corrective actions

- Act as primary technical interface with BESI and Kinex product engineering teams - Coordinate technical reviews, service activities, upgrades, and modifications - Manage escalation of hardware and software issues - Support implementation of engineering changes and new capabilities

- Support hybrid bonding process development activities - Work closely with CTO process engineers and researchers - Enable wafer-to-wafer and die-to-wafer bonding development - Support new module integration and experimental hardware evaluations

- BS in Mechanical Engineering, Electrical Engineering, Mechatronics, Systems Engineering or related engineering discipline - 3-7 years of engineering experience in semiconductor equipment - new college graduates applications will NOT be considered - Experience supporting semiconductor manufacturing or development equipment - Strong troubleshooting and root-cause analysis skills - Excellent verbal and written communication skills - Ability to work across facilities, vendors, process engineering, and operations teams

- Experience with advanced packaging equipment - Experience with hybrid bonding, wafer bonding, die attach, packaging, or assembly systems - Experience with wet clean processes and systems - Equipment installation and startup experience - Facilities hookup and utility integration experience - Vendor management and supplier coordination experience - Hands-on experience troubleshooting complex semiconductor equipment

- Automated material handling systems - Vacuum systems - Plasma processing systems - Wet processing equipment - Metrology systems

- Site prep / installation documentation - Equipment specifications - Startup plans - Qualification procedures

- Prior experience with BESI equipment - Hybrid bonding process knowledge - 300 mm equipment experience - Project management experience - Cleanroom construction or tool installation experience