Package Development, Signal Integrity and Power Integrity Engineer, Principal

- Bachelor's degree in Computer Science, Electrical Engineering or related fields and 5 - 8 years of related professional experience or Master's/PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience. - Strong fundamentals in EM, transmission lines and microwave theory - Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity - Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing. - Familiarity with IC package layout tools like APD or PADS - Familiarity with Co-Packaged Optics and Optics packaging is a plus - Experience with 2.5D/3D package development is highly desired. - Ability to automate the SI, PI and Packaging activities using scripting tools like Python. - Working knowledge of circuit design tools: Spectre, ADS, HSpice - Experience with VNA and TDR measurements for package and PCB characterization - Frequency domain and time domain knowledge of high speed signaling - Experience with high-speed electronic packaging for digital and analog ICs - Power plane design, modeling and analysis using tools like PowerSI, SIwave - Familiarity with packaging technologies, materials, package substrate design rules and assembly rules - Understanding, debugging and simulations of EMI/EMC problems - Track record of new product introduction from concept, through development and production is a plus. - Knowledge of the thermal and mechanical analysis of the IC package development is a plus. - Experience with channel simulations using MATLAB or ADS or other tools is a plus. - A team player - Strong communication, presentation, and documentation skills