Principal Collateral Device Engineer

Intel is transforming from an Integrated Device Manufacturer (IDM) to a leading foundry service provider, offering world-class manufacturing capabilities to customers worldwide. Our Manufacturing Development and Customer Engineering (MDCE) organization is at the forefront of this transformation, focusing on yield improvement, performance optimization, and exceptional customer service delivery.

We are seeking a Principal Collateral Device Engineer to join our team within MDCE. This role requires regular onsite presence to fulfill essential job responsibilities and will creates next generation device and interconnect technology by ensuring the process device performance for developing processes is world class, using deep understanding of device physics.

- Demonstrated expertise in leading cross functional group in defining derivative architectures including Design rules, transistors and interconnects. Expertise in CMOS semiconductor device physics and test chip design for advanced transistor device architecture.

- Experience in scribe line layout design and process monitoring structure development.

- Proficiency in design rule development, validation, and waiver management processes.

- Strong understanding of DTCO skills Including understanding of SRAM, Standard cells and be the key interface and bridge between Process Integration , Yield, Device and Design.

- Strong skills in data analysis, scripting, and statistical techniques for test chip data interpretation.

- Excellent technical problem-solving skills with ability to balance design rule compliance with customer flexibility needs.

- Ability to work collaboratively in globally diverse, cross-disciplinary teams to develop innovative device collateral solutions.

- Demonstrated experience with design of experiment (DOE) principles applied to device collateral optimization.

- Proven track record of delivering device collateral solutions in a fast-paced manufacturing environment.

- Desire to learn, lead, and influence cross-functional teams in collateral development and design rule optimization.

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

- Master's degree in Electrical Engineering, Physics, or related field

- 15+ years of experience in CMOS device engineering with focus on test chip design and device collateral development

- Ph.D. degree in Electrical Engineering, Physics, or related field

- 15+ years of experience in CMOS device engineering and collateral development

- Hands-on experience in advanced node test chip design and scribe line optimization for 3nm-16nm FinFETs and sub 3nm GAA FETs

- Experience with design rule checker (DRC) development and physical verification flows

- Experience in High-Volume Manufacturing environment with focus on yield monitoring and process control structures

- Knowledge of statistical process control (SPC) and advanced data analytics for device collateral optimization

Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.

We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Position of Trust This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position.

For additional questions, please contact your Recruiter.

Annual Salary Range for jobs which could be performed in the US: $224,970.00-317,600.00 USD

Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.