MTS Field Application Eng - RF & Photonics

the opportunity to DWIN and on towards t apeout . The FAE should understand and surmount any barriers of adoption the client may have for using GF technologies for their product development. FAE will work cross functionally with internal GF technical experts in pursuit of converting these opportunities to revenue.

- Engage cust omers to understand their technical needs towards the d evelopment of their semiconductor IC products.

- Assess the competitive landscape to identify and advocate winning GF value propositions.

- Partner internally with GF account managers, product marketing, and technical experts in the creation of compelling, application specific presentations to describe how GF technology solutions can help those customers develop their industry winning products.

- Work closely with the account management team to merge technical and commercial terms into a design-winning proposal.

- Identify and resolve all issues / concerns to convert the DWIN into product Tapeout .

- Where competitive gaps exist, advocate internally for improved features and capabilities of GF solutions to close such gaps.

- Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

- Education - Bachelors or Masters degree in electrical engineering or equivalent ( e.g. applied physics, etc ).

- Experience - Minimum 10 yrs in semiconductor design, tapeout and process.

- Skills - Working knowledge of IC chip design flows and tools from architectural definition through performance characterization for RF and Photonics technologies . Technical Program Management, a ctive thinking, positive attitude, problem solving, strong responsibility and ownership, teamwork and personal communication skills are critical.

- Travel - Up to 20%, primarily domestic with some international travel.

- Education - Master's or PhD in electrical engineering or equivalent.

- Experience - 5 yrs in semiconductor product design at the chip or module level.

- Skills - Direct experience in IC chip design flows and EDA tools from architectural definition through performance characterization. Exposure/Experience in one or more of Digital / Analog Mixed Signal/HV Power/ eNVM / Millimetre Wave/Silicon Photonics IC product design highly desirable. SoC product integration/design experiences highly desirable.

- Demonstrated expertise in business development within the Defense Industrial Base or related government agencies

- Project management skills - i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.

The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

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