2026 Fall Process Integration Engineer Co-op (Cambridge, MA)

Applied Materials’ Integrated Materials Solution Group is searching for an intern to join our team in fall 2026 for 6+ months. Our group explores and builds novel devices in the ICAPS (Internet of Things, Communications, Automotive, Power and Sensors) and Advanced wafer level heterogeneous integration technology sectors.

Our opportunity will give you hands-on experience in semiconductor and advanced packaging process environments, and help you establish an understanding of the relationships between device design, material physics, process development, technology integration and functional characterization.

• Assist with fabrication of proof-of-concept devices, which may include one or more of the following: device layout, wafer processing, metrology and characterization, physical and electrical data analysis, and documentation.

• Lead small development projects involving wafer metrology, material characterization and data analysis

• Support process integration engineering through procurement, shipping, and inventory functions

• Starts in Jul/Aug 2026 for 6+ months. Onsite in Cambridge, MA.

• Student must be pursuing a Master’s or Phd degree program in materials science, chemical engineering, electrical engineering, physics or chemistry, or related field.

• Student must be in good academic standing at their university, with a preferred GPA of 3.0 or above on a 4.0 scale

• Experience in semiconductor processing or manufacturing preferred

• A passionate drive, a curious mind and adaptable spirit are expected.

Applications will be reviewed on a rolling basis. Note: This position may close early based on application volume or candidate selection