Samsung Semiconductor

CVD Process Engineer - Wafer Bonding

Full-time · 12100 Samsung Blvd, Austin, TX
✓ Verified live on the employer's own system · added 31 days ago
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Mid-level · 5+ yrs exp

Requirements

Education: Bachelor's degree or related field

Experience: 5+ years

Skills & tools

Team LeadershipTroubleshootingRecordkeepingPreventive MaintenanceMaintenanceManagementSasData Analysis

Benefits — mentioned in this posting

Paid time off
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Full job description

About Samsung Austin Semiconductor Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow.

Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in the area of wafer bonding and de-bonding. The primary duties include designing and executing process experiments, analyzing bonding quality and reliability, troubleshooting process issues, and collaborating with cross-functional teams to improve bonding techniques.

This role must ensure compliance with industry standards and maintains detailed documentation of process parameters and results. The technical aspects of bonding equipment operation will be the primary responsibility and to ensure smooth 24 / 7 wafer bonding operation.

  • Prepare and calibrate bonding and debonding equipment according to manufacturer specifications and process requirements
  • Ensure tool to tool matching across fabs and between tools
  • Develop and maintain Preventative Maintenance schedules and procedures
  • Ensure bonding meets device and process output specifications
  • Successfully transfer and qualify process from development fab to HVM facility
  • Investigate wafer bonding issues, create troubleshooting plans, and apply corrective action plans
  • Provide clear updates and instructions to users and management regarding ongoing issues and resolutions
  • Lead development and design experiments to carry out improvements in bonding yield, reliability, cost, and throughput
  • Collaborate with vendors in evaluation and qualification on new bonding and de-bonding techniques.
  • Providing technical support and training to operators and technicians on equipment operation and procedures
  • Present key technical developments to SAS technical staff and management
  • Knowledge and familiarity with hybrid bonging techniques and equipment
  • Bachelor’s degree in Engineering or a related technical discipline.
  • Minimum of 5 years of engineering experience in Fab Equipment management
  • Minimum of 3 years in experience in wafer bonding and de-bonding equipment
  • Experience in the semiconductor environment or in high volume advanced manufacturing
  • Desire to take on technical challenges and shifting priorities in a fast paced cutting edge environment
  • Experience with data analysis: able to quickly analyze, summarize, and present data in an easy to understand format
  • Experience with project management and project prioritization. Ability to define milestones for a project, work in parallel on multiple projects, and balance long term projects with daily sustaining.
  • Ability to rapidly come up to speed with new computer applications and systems
  • Able to work for several hours per day in a clean room environment
  • Knowledge and familiarity with semiconductor equipment: vacuum systems, RF systems, plasma, MFCs, pneumatic valves, recipes, safety considerations & protocols, schematics, maintenance scheduling, etc.
  • Ability to manipulate and interpret equipment sensor data for the purpose of advanced equipment troubleshooting and setting up of controls for equipment sensors

The current base salary range for this role is between $70,480- $179,090. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.

Total Rewards At Samsung Austin Semiconductor, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.

  • Paid time off (PTO) + 2 personal holidays and 10 regular holidays

Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.

All positions at Samsung Austin Semiconductor are full-time on-site.

U.S. Export Control Compliance This role may require access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.

Trade Secrets Notice By submitting an application, you agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.

* Please visit Samsung membership to see Privacy Policy, which defaults according to your location. You can change Country/Language at the bottom of the page. If you are European Economic Resident, please click here .

* Samsung Electronics America, Inc. and its subsidiaries are committed to Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, status as a qualified individual with a disability, or any other characteristic protected by law.

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