Principal Mechanical Design Engineer

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

Description:

You will be a Principal Mechanical Design Engineer with Qorvo’s SSPA hardware engineering team, playing a pivotal role in the mechanical design and development of high-power microwave and millimeter-wave amplifiers, subsystems, and fully integrated LRUs, driving innovation, performance, and reliability across complex products and systems.

• Partner closely with SSPA engineering disciplines, senior program leadership, production, and quality teams to drive successful outcomes.
• Design high-performance electronics and RF systems, including ruggedized enclosures, RF subassemblies, PCBAs, harnesses, and cables.
• Develop efficient thermal management solutions for high-power electronics, including liquid cold plates and advanced air-cooling strategies (fans, blowers, and ram-air).
• Select and specify materials, components, and manufacturing processes to meet size, weight, power, cost, environmental, and schedule objectives.
• Proactively identify and mitigate risks through rigorous analysis and well-defined verification testing.
• Perform detailed thermal analysis, from system-level modeling to die/channel temperatures; structural FEA analysis including shock, vibration, and acceleration assessments.

• Bachelor of Science or Masters Degree in Mechanical Engineering or relevant discipline.
• Minimum of 12 years experience in mechanical design of ruggedized electronics.
• Demonstrated expertise in FEA-based thermal and structural analysis of electronics and electronics enclosures.
• Strong background in technical data package development, including BOM creation, 2D drawings, and 3D modeling.
• Working knowledge of GD&T (Geometric Dimensioning and Tolerancing).
• Excellent written and verbal communication skills with the ability to collaborate effectively across teams.
• Proficiency in Microsoft Office applications (Excel, Word, PowerPoint)..

• Experience designing electronics packaging for microwave and millimeter wave circuits, modules and antennas.
• Experience with military and aerospace specifications: MIL-STD-810, MIL-STD-461, DO-160.
• Experience with Solidworks, Flotherm CFD, Ansys Structures FEA.
• Proven ability to manage multiple tasks and programs.

This position is not eligible for visa sponsorship by the Company.

This position requires a Security Clearance. Applicant must be a US Citizen and have the ability to obtain and maintain a US Government security clearance.

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MAKE A DIFFERENCE AT QORVO

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.