Signal & Power Integrity Hardware ASIC Simulation Engineer (Hybrid)

We are seeking a qualified Signal and Power Integrity Engineer to help us develop our next generation ASIC packaging to help define, design and verify ASIC packaging to be deployed in a range of Cisco platforms.

- Develop, document, and implement design rules for ultra-high-speed signaling, ensuring power, performance, and area goals are met for products.

- Analyze substrate signal integrity (SI) and power integrity (PI), providing feedback and collaborating with the layout team to develop optimal solutions across interposer, substrate, and PCB.

- Design, document, and develop ASIC packages for high-volume, high-quality release, including post-layout extraction and reporting.

- Collaborate with system partners, vendors, and design leads to achieve combined power and signal integrity and to resolve complex technical issues using advanced technology design rules.

- Bachelor's degree in Electrical Engineering and 4+ years of relevant signal and power integrity experience, or Master's degree in Electrical Engineering and 2+ years of relevant signal and power integrity experience, or PhD in Electrical Engineering and 0+ years of related experience, or equivalent related work experience.

- High-Speed Design & Theory: Expertise in high-speed design principles, including Transmission Line Theory, electromagnetics, scattering parameters, and impedance network analysis, applied to 56G PAM4 SerDes architectures, channel modeling, and BER prediction.

- SI/PI Simulation Proficiency: Experience with pre- and post-layout signal and power integrity (SI/PI) simulations using industry-standard EDA tools such as Cadence Sigrity, Ansys HFSS, and Keysight ADS.

- Layout Review & Physical Validation: Experience conducting detailed layout reviews and physical design validation using tools such as Cadence APD and Ansys EM flows to ensure signal performance and crosstalk mitigation.

- Circuit Analysis: Working knowledge of SPICE for circuit-level analysis, signal modeling, and performance validation.

- Skilled in articulating ideas and technical concepts to diverse audiences, both verbally and in writing.

- Experience with high-bandwidth memory (HBM) or high-speed memory interface SI.

- Experience with die-to-die interfaces (UCIe or proprietary).

- Experience with advanced packaging (CoWoS, EMIB, interposer-based designs), including SI/PI analysis of 2.5D ASIC packaging.

The starting salary range posted for this position is $152,500.00 to $219,200.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits.