Experience: 6+ years
Key
responsibilities: * Serve as a technical leader in advanced packaging technology (2.5D/3D, TSV, MCM, flip-chip, heterogenous integration). Oversee various aspects such as package assembly, process development, reliability qualification, materials and testing. * Work with top-tier package assembly partners to develop and qualify packaging solutions for Cisco products. * Multi-functional technical leadership to proactively identify and mitigate risks, and resolve highly complex packaging issues.
Drive/support quality initiatives such as failure analysis (FA), root cause finding, and implementation of corrective actions. * Work collaboratively with design teams to influence package architecture and provide expert guidance on Design for Manufacturability/Reliability (DfM, DfR) contributing to the definition of critical parameters for HVM. * Contribute to evaluation of new packaging methods, materials and processes for Cisco product design and implementation.
* 6+ years of progressive industry experience in Semiconductor Packaging or Photonic packaging or Assembly process development or integration, with demonstrable track record of technical leadership and successful project execution. * Knowledge of advanced packaging processes (bumping, flip-chip, TSV, 2.5D/3D, MCM) and materials * Experience with package design & architecture.
Familiar with advanced substrate manufacturing processes and materials and their impact on signal and power integrity. * Experience in advanced problem-solving methodologies (e.g. 8D, FMEA, statistical process control) and data analysis skills * Knowledge and experience in physical failure analysis methods.
* Familiarity or experience with co-packaged optics is a plus * Experience with volume manufacturing * Experience with advanced simulation tools for package design and reliability analysis * Ability to work within and lead projects with highly multi-functional and geographically distributed technical teams. * Willingness to learn and evolve professionally
The starting salary range posted for this position is $168,800.00 to $241,200.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits.
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