Senior Package Layout Engineer - Hardware

- As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.

- Optimize package pinout incorporating system level trade-offs of pins assignment.

- Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.

- Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.

- Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.

- Develop symbols and CAD library databases using Cadence APD design tools

- Hold a B.S. Electrical Engineering or equivalent experience

- 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus

- Proven experience in substrate layout of wire bond and flip chip packages, preferred

- Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)

- Solid understanding of high-speed design signal integrity practices

NVIDIA is widely considered to be one of the technology world's most desirable employers! We have some of the most forward-thinking and dedicated people in the world working for us. If you're creative and autonomous, we want to hear from you.

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 136,000 USD - 212,750 USD for Level 3, and 168,000 USD - 258,750 USD for Level 4.

Applications for this job will be accepted at least until August 10, 2026.